TUTCRIS - Tampereen teknillinen yliopisto


Self-alignment in the stacking of microchips with mist-induced water droplets



JulkaisuJournal of Micromechanics and Microengineering
DOI - pysyväislinkit
TilaJulkaistu - tammikuuta 2011
OKM-julkaisutyyppiA1 Alkuperäisartikkeli


This paper reports a novel and versatile water droplet self-alignment technique where the water is delivered in mist form onto the assembly site. The droplet forming process has been carefully investigated using machine vision, where each individual droplet on the microchip surface can be identified and the volume per surface area can be calibrated at a specific time. The result reveals that the volume of water droplets on the assembly surface grows linearly as a function of time. Self-alignment based on the mist-induced droplets has been studied, where a robotic microgripper is used to deliver the microchips on the assembly site. The paper also investigates the maximum tolerance of the initial placement error in stacking SU-8 chips 200 × 200 × 70 μm in size, and the possibility of stacking two SU-8 chips of different dimensions using the proposed self-alignment technique. Moreover, self-alignment of chips on hydrophilic/hydrophobic patterns covered by mist-induced water droplets has been studied. The experimental results indicate that this novel self-alignment technique is very promising. Furthermore, a statistical model has been used to validate the experimental results.