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TUTCRIS

Solder balling of lead-free solder pastes

Tutkimustuotosvertaisarvioitu

Standard

Solder balling of lead-free solder pastes. / Arra, M.; Shangguan, D.; Ristolainen, E.; Lepistö, T.

julkaisussa: Journal of Electronic Materials, Vuosikerta 31, Nro 11, 2002, s. 9 p.

Tutkimustuotosvertaisarvioitu

Harvard

Arra, M, Shangguan, D, Ristolainen, E & Lepistö, T 2002, 'Solder balling of lead-free solder pastes', Journal of Electronic Materials, Vuosikerta. 31, Nro 11, Sivut 9 p.

APA

Arra, M., Shangguan, D., Ristolainen, E., & Lepistö, T. (2002). Solder balling of lead-free solder pastes. Journal of Electronic Materials, 31(11), 9 p.

Vancouver

Arra M, Shangguan D, Ristolainen E, Lepistö T. Solder balling of lead-free solder pastes. Journal of Electronic Materials. 2002;31(11):9 p.

Author

Arra, M. ; Shangguan, D. ; Ristolainen, E. ; Lepistö, T. / Solder balling of lead-free solder pastes. Julkaisussa: Journal of Electronic Materials. 2002 ; Vuosikerta 31, Nro 11. Sivut 9 p.

Bibtex - Lataa

@article{fc296ef4098846ae85ecf6168ebf542c,
title = "Solder balling of lead-free solder pastes",
author = "M. Arra and D. Shangguan and E. Ristolainen and T. Lepist{\"o}",
note = "Contribution: organisation=ele,FACT1=1",
year = "2002",
language = "English",
volume = "31",
pages = "9 p",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Institute of Electrical and Electronics Engineers",
number = "11",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Solder balling of lead-free solder pastes

AU - Arra, M.

AU - Shangguan, D.

AU - Ristolainen, E.

AU - Lepistö, T.

N1 - Contribution: organisation=ele,FACT1=1

PY - 2002

Y1 - 2002

M3 - Article

VL - 31

SP - 9 p

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 11

ER -