TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Titanium Nitride Microelectrodes Deposited by Ion Beam Assisted E-beam Evaporation

Tutkimustuotos: Konferenssiesitys, posteri tai abstrakti

Yksityiskohdat

AlkuperäiskieliEnglanti
DOI - pysyväislinkit
TilaJulkaistu - 24 kesäkuuta 2016
TapahtumaMEA meeting 2016 -
Kesto: 28 kesäkuuta 20161 heinäkuuta 2016
http://www.nmi.de/meameeting/

Conference

ConferenceMEA meeting 2016
Ajanjakso28/06/161/07/16
www-osoite

Tiivistelmä

An alternative method for fabricating titanium nitride (TiN) microelectrodes is presented. In order to decrease the impedance and noise levels of microelectrodes, one of the most common methods is to coat the electrodes with TiN. Usually that has required the use of a sputtering device, but we have demonstrated that also an e-beam coater can be used for TiN deposition, if equipped with an ion source. Our first 30 µm microelectrodes fabricated by ion beam assisted deposition (IBAD) have impedances around 75 kΩ, which is close to the impedances reported for sputter deposited TiN microelectrodes.