TUTCRIS - Tampereen teknillinen yliopisto

TUTCRIS

Undercut edges for robust capillary self-alignment in hybrid microassembly

Tutkimustuotosvertaisarvioitu

Yksityiskohdat

AlkuperäiskieliEnglanti
Otsikko8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Sivut1088-1091
Sivumäärä4
DOI - pysyväislinkit
TilaJulkaistu - 2013
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
Tapahtuma8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, Kiina
Kesto: 7 huhtikuuta 201310 huhtikuuta 2013

Conference

Conference8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
MaaKiina
KaupunkiSuzhou
Ajanjakso7/04/1310/04/13

Tiivistelmä

In this paper, we report capillary self-alignment of 200 μm × 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Sub-micron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).