Use of microcutting for high throughput electrode patterning on a flexible substrate
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Yksityiskohdat
| Alkuperäiskieli | Englanti |
|---|---|
| Artikkeli | 015015 |
| Sivumäärä | 7 |
| Julkaisu | Journal of Micromechanics and Microengineering |
| Vuosikerta | 24 |
| Numero | 1 |
| DOI - pysyväislinkit | |
| Tila | Julkaistu - tammikuuta 2014 |
| OKM-julkaisutyyppi | A1 Alkuperäisartikkeli |
Tiivistelmä
The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.