Use of microcutting for high throughput electrode patterning on a flexible substrate

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Use of microcutting for high throughput electrode patterning on a flexible substrate. / Janka, M.; Tuukkanen, S.; Tuorila, H.; Viheriälä, J.; Honkanen, M.; Stingelin, N.; Lupo, D.

julkaisussa: Journal of Micromechanics and Microengineering, Vuosikerta 24, Nro 1, 015015, 01.2014.

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Bibtex - Lataa

@article{4a030c9fdf294ff292575dc208decc5f,

title = "Use of microcutting for high throughput electrode patterning on a flexible substrate",

abstract = "The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.",

keywords = "microcutting, self-alignment, NIL, hot embossing, FIELD-EFFECT TRANSISTORS, NANOIMPRINT LITHOGRAPHY, THIN, CIRCUITS, FILMS, STEP",

author = "M. Janka and S. Tuukkanen and H. Tuorila and J. Viheri{\"a}l{\"a} and M. Honkanen and N. Stingelin and D. Lupo",

note = "Contribution: organisation=elt,FACT1=0.6 Contribution: organisation=orc,FACT2=0.3 Contribution: organisation=mol,FACT3=0.1 Portfolio EDEND: 2014-05-08 Publisher name: Institute of Physics Publishing",

year = "2014",

month = "1",

doi = "10.1088/0960-1317/24/1/015015",

language = "English",

volume = "24",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

publisher = "IOP Publishing",

number = "1",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Use of microcutting for high throughput electrode patterning on a flexible substrate

AU - Janka, M.

AU - Tuukkanen, S.

AU - Tuorila, H.

AU - Viheriälä, J.

AU - Honkanen, M.

AU - Stingelin, N.

AU - Lupo, D.

N1 - Contribution: organisation=elt,FACT1=0.6 Contribution: organisation=orc,FACT2=0.3 Contribution: organisation=mol,FACT3=0.1 Portfolio EDEND: 2014-05-08 Publisher name: Institute of Physics Publishing

PY - 2014/1

Y1 - 2014/1

N2 - The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.

AB - The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.

KW - microcutting

KW - self-alignment

KW - NIL

KW - hot embossing

KW - FIELD-EFFECT TRANSISTORS

KW - NANOIMPRINT LITHOGRAPHY

KW - THIN

KW - CIRCUITS

KW - FILMS

KW - STEP

U2 - 10.1088/0960-1317/24/1/015015

DO - 10.1088/0960-1317/24/1/015015

M3 - Article

VL - 24

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

SN - 0960-1317

IS - 1

M1 - 015015

ER -

TUTCRIS