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Use of microcutting for high throughput electrode patterning on a flexible substrate

Tutkimustuotosvertaisarvioitu

Standard

Use of microcutting for high throughput electrode patterning on a flexible substrate. / Janka, M.; Tuukkanen, S.; Tuorila, H.; Viheriälä, J.; Honkanen, M.; Stingelin, N.; Lupo, D.

julkaisussa: Journal of Micromechanics and Microengineering, Vuosikerta 24, Nro 1, 015015, 01.2014.

Tutkimustuotosvertaisarvioitu

Harvard

Janka, M, Tuukkanen, S, Tuorila, H, Viheriälä, J, Honkanen, M, Stingelin, N & Lupo, D 2014, 'Use of microcutting for high throughput electrode patterning on a flexible substrate', Journal of Micromechanics and Microengineering, Vuosikerta. 24, Nro 1, 015015. https://doi.org/10.1088/0960-1317/24/1/015015

APA

Vancouver

Janka M, Tuukkanen S, Tuorila H, Viheriälä J, Honkanen M, Stingelin N et al. Use of microcutting for high throughput electrode patterning on a flexible substrate. Journal of Micromechanics and Microengineering. 2014 tammi;24(1). 015015. https://doi.org/10.1088/0960-1317/24/1/015015

Author

Janka, M. ; Tuukkanen, S. ; Tuorila, H. ; Viheriälä, J. ; Honkanen, M. ; Stingelin, N. ; Lupo, D. / Use of microcutting for high throughput electrode patterning on a flexible substrate. Julkaisussa: Journal of Micromechanics and Microengineering. 2014 ; Vuosikerta 24, Nro 1.

Bibtex - Lataa

@article{4a030c9fdf294ff292575dc208decc5f,
title = "Use of microcutting for high throughput electrode patterning on a flexible substrate",
abstract = "The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.",
keywords = "microcutting, self-alignment, NIL, hot embossing, FIELD-EFFECT TRANSISTORS, NANOIMPRINT LITHOGRAPHY, THIN, CIRCUITS, FILMS, STEP",
author = "M. Janka and S. Tuukkanen and H. Tuorila and J. Viheri{\"a}l{\"a} and M. Honkanen and N. Stingelin and D. Lupo",
note = "Contribution: organisation=elt,FACT1=0.6<br/>Contribution: organisation=orc,FACT2=0.3<br/>Contribution: organisation=mol,FACT3=0.1<br/>Portfolio EDEND: 2014-05-08<br/>Publisher name: Institute of Physics Publishing",
year = "2014",
month = "1",
doi = "10.1088/0960-1317/24/1/015015",
language = "English",
volume = "24",
journal = "Journal of Micromechanics and Microengineering",
issn = "0960-1317",
publisher = "IOP Publishing",
number = "1",

}

RIS (suitable for import to EndNote) - Lataa

TY - JOUR

T1 - Use of microcutting for high throughput electrode patterning on a flexible substrate

AU - Janka, M.

AU - Tuukkanen, S.

AU - Tuorila, H.

AU - Viheriälä, J.

AU - Honkanen, M.

AU - Stingelin, N.

AU - Lupo, D.

N1 - Contribution: organisation=elt,FACT1=0.6<br/>Contribution: organisation=orc,FACT2=0.3<br/>Contribution: organisation=mol,FACT3=0.1<br/>Portfolio EDEND: 2014-05-08<br/>Publisher name: Institute of Physics Publishing

PY - 2014/1

Y1 - 2014/1

N2 - The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.

AB - The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.

KW - microcutting

KW - self-alignment

KW - NIL

KW - hot embossing

KW - FIELD-EFFECT TRANSISTORS

KW - NANOIMPRINT LITHOGRAPHY

KW - THIN

KW - CIRCUITS

KW - FILMS

KW - STEP

U2 - 10.1088/0960-1317/24/1/015015

DO - 10.1088/0960-1317/24/1/015015

M3 - Article

VL - 24

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

SN - 0960-1317

IS - 1

M1 - 015015

ER -